PC gamers and overclockers will already be familiar with the concept of running pipes of liquid around components in order to keep the temperature down, but getting the same technology inside a thin smartphone is a serious challenge - Samsung's solution could end up being just 0.6 mm thick, the unconfirmed report says.
If the South Korean manufacturer can pull off the trick, it would be able to pack more powerful components inside the Galaxy S7 and its variants. Overheating issues have dogged some of the greatest phones of 2015 and no one wants a repeat performance next year.
Following Sony and Microsoft
It has been done before: both the Xperia Z5 and the Lumia 950 XL feature liquid cooling systems built in, so Samsung's engineers know it's possible - now all they have to do is figure out a way to incorporate it without adding too much to the bulk or cost of the phone.
We've already seen an avalanche of rumours and reports around Samsung's next-generation handset, which could launch as early as January: a serious camera upgrade, a microSD card slot and an upgraded type of toughened display glass have all been mooted.
If new liquid cooling technology does indeed make the cut next year, chances are you won't be able to tell the difference at first glance - but you should find your new handset getting warm to the touch far less often.