Late last month, we told you that MediaTek was reportedly working on the Helio X30 chipset. Today, analyst Pan Jiutang confirmed the existence of the chip. The Helio X30 is expected to be built by TSMC using the 10nm FinFET process, making it twice as efficient as the Helio X20.
The new SoC will employ ARM's new Artemis cores along with older Cortex cores, and will continue to employ the tri-cluster designed used by its predecessor.
While Jiutang's post didn't include a breakdown of the X30's specs, the information that we passed along last month calls for it to be equipped with a pair of 2.8GHz Artemis cores, four 2.2GHz Cortex-A53 cores and four 2GHz Cortex-A35 cores. The PowerVR 7XT GPU will handle graphics. The Helio X30 will support a dual camera set up, a 26MP camera, VR connections, LTE Cat.13 connectivity, and 8GB of RAM.
On his Weibo page, Jiutang posted a chart comparing AnTuTu benchmark scores of various chipsets. The Helio X30 scored 160,000 on the test, topping the list. Right behind was the Snapdragon 820 SoC, currently the latest and greatest chip offered by Qualcom and employed on devices like the Samsung Galaxy S7 (in the U.S. and China), LG G5and the HTC 10. The Helio X20 SoC, MediaTek's first chip to feature a deca-core CPU, was next with a score of 100,000.
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